PCB’s high copper thickness


The increase in demand in printed circuit High Power and higher cooling requirements, at the same time with more complexity, requires the development of new concepts. Therefore CIPSA using their experience in the production of printed circuits and multilayer to 400 µm, can offer its customers the manufacture of mixed multilayers, with a copper thickness on inner layers from 105 µm to 400 µm, with outer layers signal or digital electronics, with less copper thickness.